Trends in Electronics

  • Data: dal 30 marzo 2016 al 27 maggio 2016

Contatto di riferimento:

April 18h, 2016

"Power Device Reliability"
Mauro Ciappa – ETHZ – Block 1
H: Noon-02:00 pm
Room: 4.2
School of Engineering and Architecture

 

April 19th, 2016

"Power Device Reliability"
Mauro Ciappa – ETHZ – Block 1
H: 9:00 am-Noon
Room: 2.7-A
School of Engineering and Architecture

 

May 4th, 2016

"Advanced Project Management"
Gaetano D'Emma
H: 3:00-5:00 pm
Room: Sala del Consiglio
School of Engineering and Architecture

 

May 5th, 2016

"Advanced Project Management"
Gaetano D'Emma
H: 1:00-3:00 pm
Room: Aula Magna
School of Engineering and Architecture

 

May 11th, 2016

"3D and ICT - where do we stand and what's next?"
Fabio Remondino - Fondazione Bruno Kessler
H: 4:00-6:00 pm
Room: 2.5
School of Engineering and Architecture

 

May 16th, 2016

"Scan compression techniques to improve test time and quality"
Jurgen Alt - Intel Munich
H: 9:00-11:00 am
Room: 5.6
School of Engineering and Architecture

 

May 17th, 2016

"Scan compression techniques to improve test time and quality"
Jurgen Alt - Intel Munich
H 9:00 am-Noon
Room: 2.7A
School of Engineering and Architecture

 

May 26h, 2016

"Ultrasound echographic systems: working principles and implementations"
Piero Tortoli
H: 2:00-4:00 pm
Room: Aula Magna
School of Engineering and Architecture